Search for European Projects

39 European Projects Found

Searched on 125080 European Projects

 FINISHED 

MAsk less lithoGraphy for IC manufacturing (MAGIC) (MAGIC)

Start date: Jan 1, 2008, End date: Dec 31, 2010,

...y of the electron beam lithography and a reasonable throughput target represents an attractive alternative for lithography and is supported by some key CMOS manufacturers around the world, like TSMC, STMicroelectronics, QIMONDA, TOSHIBA, and Texas Instruments.This project proposes to support the development of ML2 technology in Europe. It is composed of two linked poles. The first one will be focu ...
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 19

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PARallel PAradigms and Run-time MAnagement techniques for Many-core Architectures (2PARMA)

Start date: Jan 1, 2010, End date: Mar 31, 2013,

...tor of 2 and to optimize the usage of system resources (such as battery power) from 20% to 35% with respect to conventional power management strategies, while preserving the target Quality of Service.STMicroelectronics will obtain faster time-to-market by exploiting improved programmability and demonstrable adaptability of the P2012 to multi-application sce-narios. Synopsys will consider the inclu ...
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 8

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Advanced TEchnology MOdelling for eXtra-functionality devices (ATEMOX)

Start date: Jul 1, 2010, End date: Nov 30, 2013,

... implement and include them into the Sentaurus TCAD platform of Synopsys so that they are of immediate value to the European semiconductor industry. The integrated models will finally be evaluated by STMicroelectronics with respect to industrial needs. To reach these ambitious goals, European companies active in complementary fields of competence  and leading European research institutes have form ...
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 14

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Trusted Computing for European Embedded devices (TOISE)

Start date: Jan 1, 2011, End date: Dec 1, 2013,

...d to align a common European position in the area. This will be actually a effort from major European semiconductor, fables and foundry players (Austriamicrosystems, Atmel, Infineon, Numonyx, NXP and STMicroelectronics), four IP providers (Intrinsic-ID, Magillem, Secure IC, Virage Logic) for PUF and secure IP infrastructure, two SME experts in Security solutions or evaluation labs (Brightsight, Fo ...
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 19

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Developing a leading-edge European Micro- and nanoelectronics cluster for energy efficient ICT (SILICON EUROPE)

Start date: Oct 1, 2012, End date: Oct 31, 2015,

...tive jobs in Europe) . They combine highly relevant research actors such as imec, CEA-Leti and Fraunhofer as well as large companies such as Philips, NXP, Globalfoundries, Infineon, STMicroelectronics and Thales. All involved clusters cover the full triple helix.Within Silicon Europe, following an in-depth analysis, joint action plans will be developed for concerted research in the field including ...
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 11

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Integrated Reconfigurable silicon photonic based optical Switch (IRIS)

Start date: Jan 1, 2014, End date: Dec 31, 2016,

...res). IRIS is strongly oriented toward industrialization as it is led by a major European telecom equipment manufacturer (Ericsson) and participated by a major European Silicon manufacturing company (STMicroelectronics), already committed to the industrialization of Silicon Photonics.
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 8

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Which Architecture Yields Two Other Generations Of Fully depleted Advanced Substrate and Technologies (WAYTOGO FAST)

Start date: May 1, 2015, End date: Apr 30, 2017,

...istributed pilot line between 2 companies: - Soitec for the fabrication of advanced engineered substrates (UTBB: Ultra Thin Body and BOx (buried oxide)) without and with strained silicon top film. - STMicroelectronics for the development and industrialization of state of the art FDSOI technology platform at 14nm and beyond with an industry competitive Power-Performance-Area-Cost (PPAC) trade-off. ...
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 32

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Integrated Cicuit Testing Software (TEST-IC)

Start date: Jul 1, 2015, End date: Jan 1, 2016,

...nd experimented. - Advanced data analysis techniques are applied - Correlation techniques are implemented to forecast device reliability.Europe has a strong share in the semiconductor market (STMicroelectronics, Infineon and NXP, already customers of ours). One of the more important global challenge is the development of new testing technologies and approach that lives up to the growing rate and c ...
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 1

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Stability Under Process Variability for Advanced Interconnects and Devices Beyond 7 nm node (SUPERAID7)

Start date: Jan 1, 2016, End date: Dec 31, 2018,

...ion will be software commercialization via the partner GSS and support of device architecture activities at CEA. Furthermore, an Industrial Advisory Board initially consisting of GLOBALFOUNDRIES and STMicroelectronics will contribute to the specifications and will get early access to the project results.
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 5

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CmOs Solutions for Mid-board Integrated transceivers with breakthrough Connectivity at ultra-low Cost (COSMICC)

Start date: Dec 1, 2015, End date: Nov 30, 2018,

...-Centers around a strong vision: mass commercialization of Si-photonics-based transceivers is possible starting in 2019 by enhancing the existing photonic integration platform of one of the partners, STMicroelectronics.COSMICC will develop optical transceivers that will be packaged on-board. Combining CMOS electronics and Si-photonics with innovative-high-throughput fiber-attachment techniques, th ...
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 11

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Internet of Food and Farm 2020 (IoF2020)

Start date: Jan 1, 2017, End date: Dec 31, 2020,

The IoF2020 project is dedicated to accelerate adoption of IoT for securing sufficient, safe and healthy food and to strengthen competitiveness of farming and food chains in Europe.It will consolidate Europe’s leading position in the global IoT industry by fostering a symbiotic ecosystem of farmers, food industry, technology providers and research institutes.The IoF2020 consortium of 73 partners, ...
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 72

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3C-SiC Hetero-epitaxiALLy grown on silicon compliancE substrates and 3C-SiC substrates for sustaiNable wide-band-Gap powEr devices (CHALLENGE)

Start date: Jan 1, 2017, End date: Dec 31, 2020,

Silicon carbide presents a high breakdown field (2-4 MV/cm) and a high energy band gap (2.3–3.2 eV), largely higher than for silicon. Within this frame, the cubic polytype of SiC (3C-SiC) is the only one that can be grown on a host substrate with the huge opportunity to grow only the silicon carbide thickness required for the targeted application. The possible growth on silicon substrate has remai ...
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 14

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Hybrid Optomechanical Technologies (HOT)

Start date: Jan 1, 2017, End date: Dec 31, 2020,

The hybrid optomechanical technologies (HOT) consortium will lay the foundation for a new generation of devices, which connect, or indeed contain, several platforms at the nanoscale in a single “hybrid” system. As hybrid interfaces they will allow to harness the unique advantages of each subsystem within a nano-scale footprint, while as integrated hybrid devices they will enable entirely novel fun ...
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 17

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ACTivating InnoVative IoT smart living environments for AGEing well (ACTIVAGE)

Start date: Jan 1, 2017, End date: Jun 30, 2020,

ACTIVAGE is a European Multi Centric Large Scale Pilot on Smart Living Environments. The main objective is to build the first European IoT ecosystem across 9 Deployment Sites (DS) in seven European countries, reusing and scaling up underlying open and proprietary IoT platforms, technologies and standards, and integrating new interfaces needed to provide interoperability across these heterogeneous ...
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 50

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Integrated Smart Spatial Exploration System (INSPEX)

Start date: Jan 1, 2017, End date: Dec 31, 2019,

"The objective of INSPEX is to make obstacle detection capabilities that are currently only feasible on autonomous vehicles available as a personal portable/wearable multi-sensor, miniaturised, low power spatial exploration system. The INSPEX System will be used for real-time 3D detection, location and warning of obstacles under all environmental conditions in indoor and outdoor environments with ...
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 9

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Deep sub-micron microprocessor for spAce rad-Hard appLIcation Asic (DAHLIA)

Start date: Jan 1, 2017, End date: Dec 31, 2019,

We propose the development of a Very High Performance microprocessor System on Chip (SoC) based on STM European 28nm FDSOI technology with multi-core ARM processors for real-time applications, eFPGA for flexibility and key European IPs, enabling faster and cost-efficient development of products for multiple space application domains. The performance is expected to be 20 to 40 times the performance ...
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 7

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AUTOmated driving Progressed by Internet Of Things (AUTOPILOT)

Start date: Jan 1, 2017, End date: Dec 31, 2019,

"Automated driving is expected to increase safety, provide more comfort and create many new business opportunities for mobility services. The market size is expected to grow gradually reaching 50% of the market in 2035. The IoT is about enabling connections between objects or "things"; it’s about connecting anything, anytime, anyplace, using any service over any network. There is little doubt that ...
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 43

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Energy for Smart Objects (EnSO)

Start date: Jan 1, 2016, End date: Dec 31, 2019,

The goal of EnSO is to develop and consolidate a unique European ecosystem in the field of autonomous micro energy sources (AMES) supporting Electronic European industry to develop innovative products, in particular in IoT markets. In summary, EnSO multi-KET objectives are:• Objective 1: demonstrate the competitiveness of EnSO energy solutions of the targeted Smart Society, Smart Health, and Smart ...
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 36

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Advancing Smart Optical Imaging and Sensing for Health (ASTONISH)

Start date: Jun 1, 2016, End date: May 31, 2019,

The ageing population and related increase in chronic diseases put considerable pressure on both the healthcare system and the society, resulting in an unsustainable rise of healthcare costs. As a result there is an urgent need to improve efficiency of care and reduce hospitalisation time in order to control cost and increase quality of life. Addressing this need, medical applications need to beco ...
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 25

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Rf Engineered substrates to FostER fEm performaNCE (REFERENCE)

Start date: Dec 1, 2015, End date: May 31, 2019,

The REFERENCE project aims to leverage a European leading edge Radio Frequency (RF) ecosystem based on RF Silicon On Insulator (SOI) disruptive technology, perceived as the most promising to address performance, cost and integration needs for RF Front End Modules (FEMs)s.The project targets to develop over the next 3 years, innovative solutions from material, engineered substrates, process, design ...
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 18

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3D Advanced Metrology and materials for advanced devices (3DAM)

Start date: Apr 1, 2016, End date: Mar 31, 2019,

The objective of the 3DAM project is to develop a new generation of metrology and characterization tools and methodologies enabling the development of the next semiconductor technology nodes. As nano-electronics technology is moving beyond the boundaries of (strained) silicon in planar or finFETs, new 3D device architectures and new materials bring major metrology and characterization challenges w ...
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 18

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Ultra-Low PoweR technologIes and MEmory architectures for IoT (PRIME)

Start date: Dec 1, 2015, End date: Mar 31, 2019,

The goal of the PRIME project is to establish an open Ultra Low Power (ULP) Technology Platform containing all necessary design and architecture blocks and components which could enable the European industry to increase and strengthen their competitive and leading eco-system and benefit from market opportunities created by the Internet of Things (IoT) revolution. Over 3 years the project will deve ...
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 19

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Silicon Photonics Transceiver and Routing technologies for High-End Multi-Socket Server Blades with Tb/s Throughput interconnect interfaces (ICT-STREAMS)

Start date: Feb 1, 2016, End date: Jan 31, 2019,

The overall objective of STREAMS is to develop the necessary Silicon Photonics Transceiver and Routing technologies towards a new, power efficient, WDM-based, Tb/s, optical on-board interconnection paradigm that enables multiple high bandwidth, point-to-point direct links on the board level, as a step forward to the realization of exa-scale computing systems. Through the migration of successful WD ...
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 10

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Validation of European high capacity rad-hard FPGA and software tools (VEGAS)

Start date: Jan 1, 2016, End date: Dec 31, 2018,

VEGAS proposes to address the key challenge of European non-dependence and competitivness regarding rad-hard FPGA for space applications. VEGAS will evaluate (following ESCC rules) and validate the first rad-hard FPGA in 65nm to directly compete with the US offering and reach TRL 7. The VEGAS project sets clear and measurable main objectives to reach a TRL 7 from TRL 5 (end of BRAVE project) as fo ...
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 11

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Smart Technologies for eneRgy Efficient Active cooling in advanced Microelectronic Systems (STREAMS)

Start date: Jan 1, 2016, End date: Dec 31, 2018,

The aim of STREAMS is to bring Europe into the new leading thermal management paradigm and maintain EU position at the forefront of ICT development. With a focused consortium gathering complementary experts, STREAMS will develop a generic active cooling thermal management solution (reaching TRL4), to keep nanoelectronic devices and systems performances at their best, while meeting IC future challe ...
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 7

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Action Plan for the future of Mobility in Europe (MOBILITY4EU)

Start date: Jan 1, 2016, End date: Dec 31, 2018,

Global socio-economic and environmental megatrends are urging for a paradigm shift in mobility and transport that involves disruptive technologies and multimodal solutions. The individual transport sectors face diverse technical and non-technical requirements and rather individual, sometimes contradicting challenges. An action plan for the coherent implementation of innovative transport and mobili ...
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 20

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NEUral computing aRchitectures in Advanced Monolithic 3D-VLSI nano-technologies (NeuRAM3)

Start date: Jan 1, 2016, End date: Dec 31, 2018,

We propose to fabricate a chip implementing a neuromorphic architecture that supports state-of-the-art machine learning algorithms and spike-based learning mechanisms. With respect to its physical architecture this chip will feature an ultra low power, scalable and highly configurable neural architecture that will deliver a gain of a factor 50x in power consumption on selected applications compare ...
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 10

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Revolutionary embedded memory for internet of things devices and energy reduction (REMINDER)

Start date: Jan 1, 2016, End date: Dec 31, 2018,

REMINDER aims to develop an embedded DRAM solution optimized for ultra-low-power consumption and variability immunity, specifically focused on Internet of Things cut-edge devices. The objectives of REMINDER are :i) Investigation (concept, design, characterization, simulation, modelling), selection and optimization of a Floating-Body memory bit cell in terms of low power and low voltage, high relia ...
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 9

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NANOmaterials: STRategies for Safety Assessments in advanced Integrated Circuits Manufacturing (NanoStreeM)

Start date: Jan 1, 2016, End date: Dec 31, 2018,

Understanding properties of nanoparticles (and in general of nano-functionalized materials) and how they behave in living systems is a relatively new area of scientific study. The scientific community has not yet been able to derive harmful properties of nanomaterials from the properties of the bulk material. So a precautionary approach is required when handling and using these materials in circum ...
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 15

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High density scalable optically interconnected Tb/s Board (Teraboard)

Start date: Dec 1, 2015, End date: Nov 30, 2018,

Optical communications are becoming always more relevant because of the continuous growth of the requiested bandwidth. In the last decade we assisted a continuous growing of transport and metro netwotks, presently the bottleneck is in the processing of the huge amount of data constituted by the growing number of users, the capacity of the content that is exchanged and the convergence of Telecom an ...
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 10

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lOw Power heterogeneous architecture for nExt generation of smaRt infrastructure and platforms in industrial and societal Applications (OPERA)

Start date: Dec 1, 2015, End date: Nov 30, 2018,

OPERA project aims at supporting these ambitious challenges with technological innovation on three main aspects: • Design next generation Low Power (LP) and Ultra-Low Power (ULP) systems, • improve energy efficiency in computing by means of heterogeneous architectures, • and provide smart and energy efficient solution for the interaction between embedded smart systems and remote small form-factor ...
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 11

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EXMO 2016: Let’s Experience Mobility

Start date: Oct 1, 2016, End date: Sep 30, 2018,

The project “EXMO 2016 – Let’s experience mobility” is submitted by the Secondary Education Institute “Garfagnana” (http://www.isigarfagnana.gov.it/),. The Institute was created on September 1st, 2013 and brought together four existing secondary schools located in Castelnuovo: the VET institute (IPSIA) “Simoni”, the Institute for commerce, accountancy and surveying (ITCG) “Campedelli”, the Technic ...
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 23

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Iniciativas Transnacionais para AcTivar o meio rural

Start date: Oct 1, 2016, End date: Sep 30, 2018,

The requirement to which it is addressed the mobility concern the acquisition by students of specialist knowledge and skills related to the following areas: - Restoration technician, variant Kitchen / Confectionery- Technical Management and Programming Information Systems- Technical Agricultural Production, variant of Plant Production- Industrial Maintenance Technician - Electromechanical- Techni ...
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 24

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Energy-efficient Heterogeneous COmputing at exaSCALE (ECOSCALE)

Start date: Oct 1, 2015, End date: Sep 30, 2018,

In order to reach exascale performance current HPC servers need to be improved. Simple scaling is not a feasible solution due to the increasing utility costs and power consumption limitations. Apart from improvements in implementation technology, what is needed is to refine the HPC application development as well as the architecture of the future HPC systems.ECOSCALE tackles this challenge by pro ...
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 8

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Bridging the Gap: world of school-world of work

Start date: Sep 19, 2016, End date: Sep 18, 2018,

The project plays an important role in the acquisition of technical and professional skills. It allows the participants to acquire hard and soft skills as well as personal and linguistic skills that provide the young trainees with a professional and initiative knowledge that they can practise on both a local and international level. Within the mobility activities, the project plans to involve 25 ...
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 26

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FOREnsic evidence gathering autonomous seNSOR (FORENSOR)

Start date: Sep 1, 2015, End date: Aug 31, 2018,

Covert evidence gathering has not seen major changes in decades. Law enforcement Agencies (LEAs) are still using conventional, manpower based techniques to gather forensic evidence. Concealed surveillance devices can provide irrefutable evidences, but current video surveillance systems are usually bulky and complicated, are often used as simple video recorders, and require complex, expensive infra ...
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 11

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Next Station: Improving Professional Skills in Galicia

Start date: Jul 4, 2016, End date: Jul 3, 2018,

General Management of Education, Vocational Training and Educational Innovation in Council of Culture and Education in Galicia is in Santiago de Compostela and manages 205 schools with Vocational Training and 1204 schools in Galicia.Educational adviser and international program coordinator promotes and coordinates european projects with 19 Vocational Training schools with their international coor ...
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 38

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Preparing R2 extension to 300mm for BCD Smart Power (R2POWER300)

Start date: Jul 1, 2015, End date: Jun 30, 2018,

R2POWER300 is committed to challenge the following Objectives: • Development and manufacturing of a multi-KET Pilot Line (i.e. Nanoelectronics, Nanotechnology, Advanced Manufacturing) • Energy Efficiency and CO2 Reduction megatrends.The project aims to achieve the following Goals:1. Set the stage for the future extension to 300mm of the R2 Fab facility located in Agrate Brianza (Italy) - i.e. l ...
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 10

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ALL-SCALE PREDICTIVE DESIGN OF HEAT MANAGEMENT MATERIAL STRUCTURES WITH APPLICATIONS IN POWER ELECTRONICS (ALMA)

Start date: Jun 1, 2015, End date: May 31, 2018,

Heat management is a paramount challenge in many cutting edge technologies, including new GaN electronic technology, turbine thermal coatings, resistive memories, or thermoelectrics. Further progress requires the help of accurate modeling tools that can predict the performance of new complex materials integrated in these increasingly demanding novel devices. However, there is currently no general ...
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 7