Search for European Projects

34 European Projects Found

Searched on 125080 European Projects

 ONGOING 

Internet of Food and Farm 2020 (IoF2020)

Start date: Jan 1, 2017, End date: Dec 31, 2020,

The IoF2020 project is dedicated to accelerate adoption of IoT for securing sufficient, safe and healthy food and to strengthen competitiveness of farming and food chains in Europe.It will consolidate Europe’s leading position in the global IoT industry by fostering a symbiotic ecosystem of farmers, food industry, technology providers and research institutes.The IoF2020 consortium of 73 partners, ...
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 72

 ONGOING 
ACTIVAGE is a European Multi Centric Large Scale Pilot on Smart Living Environments. The main objective is to build the first European IoT ecosystem across 9 Deployment Sites (DS) in seven European countries, reusing and scaling up underlying open and proprietary IoT platforms, technologies and standards, and integrating new interfaces needed to provide interoperability across these heterogeneous ...
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 50

 ONGOING 
We propose the development of a Very High Performance microprocessor System on Chip (SoC) based on STM European 28nm FDSOI technology with multi-core ARM processors for real-time applications, eFPGA for flexibility and key European IPs, enabling faster and cost-efficient development of products for multiple space application domains. The performance is expected to be 20 to 40 times the performance ...
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 7

 FINISHED 
VEGAS proposes to address the key challenge of European non-dependence and competitivness regarding rad-hard FPGA for space applications. VEGAS will evaluate (following ESCC rules) and validate the first rad-hard FPGA in 65nm to directly compete with the US offering and reach TRL 7. The VEGAS project sets clear and measurable main objectives to reach a TRL 7 from TRL 5 (end of BRAVE project) as fo ...
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 11

 FINISHED 

Energy-efficient Heterogeneous COmputing at exaSCALE (ECOSCALE)

Start date: Oct 1, 2015, End date: Sep 30, 2018,

In order to reach exascale performance current HPC servers need to be improved. Simple scaling is not a feasible solution due to the increasing utility costs and power consumption limitations. Apart from improvements in implementation technology, what is needed is to refine the HPC application development as well as the architecture of the future HPC systems.ECOSCALE tackles this challenge by pro ...
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 8

 FINISHED 
SMEs play a key role in European economies; they constitute the largest business block and provide the bulk of employment. They generate most of the innovative ideas for ICT and CPS-enabled IoT products, two areas which represent an inflection point for innovators and industry in Europe. EuroCPS is an ambitious project that aims to arm Europe with a network of design centres that will boost and i ...
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 15

 FINISHED 

Pilot Optical Line for Imaging and Sensing (POLIS)

Start date: Jan 6, 2014, End date: Jan 6, 2018,

The KET pilot line project POLIS is aimed at maintaining and furthering the innovation capability of CMOS image and optical sensors in Europe. An existing ST CMOS high volume production line, unique in Europe, will serve as the basis of the proposed project. The strategy behind POLIS lies in the development of specific technological modules and to implement them at pilot line level on the existing ...
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 20

 FINISHED 

PANACHE

Start date: Jan 2, 2014, End date: Jan 2, 2018,

Pilot line for Advanced Nonvolatile memory technologies for Automotive microControllers, High security applications and general Electronics :The PANACHE project objective is to set-up a pilot line for embedded Flash technology design and manufacturing platform for the prototyping of innovative µcontrollers in Europe.The current 40nm technology platform as well as the already defined 55nm technolog ...
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 21

 FINISHED 

THINGS2DO (THINGS2D0)

Start date: Jan 1, 2014, End date: Jan 1, 2018,

Develop the FDSOI ecosystem in Europe, beyond the PLACES2BE Pilot Line, in order to increase the impact of this European technology. At the time of set up of the first KET pilot line the proof of FDSOI was mainly technological. In between then and now, the first realization of a complex silicon chip in FDSOI has shown to the worldwide microelectronics community the capabilities of this technology. ...
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 44

 FINISHED 

Small cEllS coordinAtion for Multi-tenancy and Edge services (SESAME)

Start date: Jul 1, 2015, End date: Dec 31, 2017,

SESAME targets innovations around three central elements in 5G: the placement of network intelligence and applications in the network edge through Network Functions Virtualisation (NFV) and Edge Cloud Computing; the substantial evolution of the Small Cell concept, already mainstream in 4G but expected to deliver its full potential in the challenging high dense 5G scenarios; and the consolidation o ...
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 21

 FINISHED 

Trusted Apps for open CPS (TAPPS)

Start date: Jan 1, 2015, End date: Dec 31, 2017,

Open and smart cyber-physical systems (CPS) are considered to be the next revolution in ICT with enormous economic potential enabling novel business models for integrated services and products. In many areas of CPS devices, there is a strong trend towards open systems, which can be extended during operation instantly adding functionalities on demand. The main goal of the TAPPS (Trusted Apps for op ...
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 9

 FINISHED 
The objective of DREAMS is to develop a cross-domain architecture and design tools for networked complex systems where application subsystems of different criticality, executing on networked multi-core chips, are supported.DREAMS will deliver architectural concepts, meta-models, virtualization technologies, model-driven development methods, tools, adaptation strategies and validation, verification ...
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 16

 FINISHED 
... istributed pilot line between 2 companies: - Soitec for the fabrication of advanced engineered substrates (UTBB: Ultra Thin Body and BOx (buried oxide)) without and with strained silicon top film. - STMicroelectronics for the development and industrialization of state of the art FDSOI technology platform at 14nm and beyond with an industry competitive Power-Performance-Area-Cost (PPAC) trade-off. ...
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 32

 FINISHED 
Vertical Cavity Surface Emitting Lasers (“VCSEL”) drive and enable a number of fast growing markets, such as data transmission, camera surveillance, optical sensors and industrial processes. They are III-V semiconductor components made from GaAs, that can be processed in a way that resembles LED or CMOS processing. Yet, the status of VCSEL manufacturing is still embryonic when compared to LED manu ...
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 9

 FINISHED 

Arrowhead (ARROWHEAD)

Start date: Mar 1, 2013, End date: Feb 28, 2017,

"Our society is facing both energy and competitiveness challenges. These challenges are tightly linked and require new dynamic interactions between energy producers and energy consumers, between machines, between systems, between people and systems, etc. Cooperative automation is the key for these dynamic interactions and is enabled by the technology developed around the Internet of Things and Ser ...
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 87

 FINISHED 

Green Computing Node for European micro-servers (EUROSERVER)

Start date: Sep 1, 2013, End date: Jan 31, 2017,

Description New 3D server architecture for better energy-efficient Data CentresData Centres (DCs) are a key resource for innovation and leadership of industry in Europe. They drive the Information Society through hosted cloud applications. To sustain the ever-increasing demand of storing and processing data, DCs need to improve their capa ...
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 14

 FINISHED 

Harnessing Performance Variability (HARPA)

Start date: Sep 1, 2013, End date: Nov 30, 2016,

Application requirements, power, and technological constraints are driving the architectural convergence of future processors towards heterogeneous many-cores. This development is confronted with variability challenges, mainly the susceptibility to time-dependent variations in silicon devices. Increasing guard-bands to battle variations is not scalable, due to the too large worst-case cost impact ...
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 8

 FINISHED 

Compound Semiconductors for 3D integration (COMPOSE3)

Start date: Nov 1, 2013, End date: Oct 31, 2016,

COMPOSE3 aims to develop 3D stacked circuits in the front end of line of Complementary Metal Oxide Semiconductor (CMOS) technology, based on high mobility channel materials. The final objective is a 3D stacked SRAM cell, designed with gates length taken from the 14nm technology node. This technology will provide a new paradigm shift in density scaling combined with a dramatic increase in the power ...
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 10

 FINISHED 
The Mont-Blanc project aims to develop a European Exascale approach leveraging on commodity power-efficient embedded technologies. The project has developed a HPC system software stack on ARM, and will deploy the first integrated ARM-based HPC prototype by 2014, and is also working on a set of 11 scientific applications to be ported and tuned to the prototype system.The rapid progress of Mont-Blan ...
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 17

 FINISHED 

COgnitive & Perceptive CAMeraS (COPCAMS)

Start date: Apr 1, 2013, End date: Sep 30, 2016,

Vision systems are becoming ubiquitous in our daily lives. Complex analysis of images from multiple cameras will become the norm in the future, from cars to industrial systems, from smart cities to facility monitoring, aimed at extracting meaningful, context-dependent information.Today’s market is dominated by a combination of relatively simple, fixed function, configurable cameras that stream vid ...
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 25

 FINISHED 
Description System optimisation through self adaptability and virtualisationThe global ICT footprint is expected to more than triple by 2020, caused by data centres that provide information at our fingertips and the mobile devices we use to access it. Nowadays, high performance systems are designed to serve rather static workloads with hi ...
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 7

 FINISHED 

PhysioDom-HDIM

Start date: Mar 1, 2014, End date: Aug 31, 2016,

Description PhysioDom–HDIM proposes an ICT platform that offers on a large territory a new service – Home Dietary Intake Monitoring based on readings and monitoring of weight, lean/fat ratio and physical activity, complemented with an intervention structure and strategy – the Home Diet Coaching. PhysioDom-HDIM is an innovative ICT solution t ...
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 10

 FINISHED 
Objectives: The general goal of this project is the industrialization of 28/20nm Fully Depleted (FD) Silicon On Insulator (SOI) Technology platforms, enabling 2 different sources in 2 different European countries. The project also aims at establishing and reinforcing a design ecosystem in Europe using these platforms. Last, the project considers extremely important to explore extension towards FD ...
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 22

 FINISHED 
European IC manufacturers are on the way to become suppliers of customized products for OEM companies, which means high flexibility and product diversity. The project aims at conducting research to support the development of new manufacturing procedures, new organizations and new information and control tools to enable IC production lines to efficiently manage a high product and technology mix and ...
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 29

 FINISHED 
Emerging and future HealthCare policies are fueling up an application driven shift toward long term monitoring of biosignals by means of embedded ultra low power Wireless Body Sensor Networks (WBSNs). In order to break out, these applications need the emergence of new technologies to allow the development of extremely power-efficient bio sensing nodes.This project aims at unlocking the development ...
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 5

 FINISHED 
Cloud Computing is an inevitable trend. In the near future almost every consumer electronics device will be connected to an ecosystem of third-party partners providing payment systems, streamed content, etc. However, a whole field of cloud services still lacks solutions because of security issues. Cloud operators and their end users (individuals, companies, etc.) do not always trust each other. As ...
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 7

 FINISHED 
This project aims to increase European Integrated Circuits (IC) quality and competitiveness by developing generic test instruments and interfaces which will drasticly improve the testability and reliability of ICs.Presently, production testing of ICs is done by large and expensive Automated Test Equipment (ATE). A disadvantage of this approach is that while the production cost of a transistor decr ...
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 16

 FINISHED 
Embedded devices are pervasive in our everyday live and their complexity increases exponentially. Among them, heterogeneous multi-core processors and specific hardware accelerators allow the required computing power while exhibiting a good performance/watt ratio. The flexibility required by them is promoting an application-centric model, which makes future systems face new challenges: Openness (to ...
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 8

 FINISHED 
Description NANOFUNCTION addresses the merging of advanced More than Moore (MtM) devices with Beyond-CMOS. Topics: Si nanowires for sensing, on-chip energy harvesting, nano-cooling and porous Si for RF passives.The NANOFUNCTION project aims to integrate at the European level the excellent European research laboratories in order to strengt ...
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 21

 FINISHED 
The ENIAC JU project MIRANDELA is building a complete digital, mixed-signal, analogue, radio frequency (RF) and millimetre-wave (MMW) platform for the design and production of chips for future wireless communications to address the challenge of transferring anything, from/to anybody, anywhere, at any time and through any path. Components in core CMOS technology and other processes will be characte ...
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 24

 FINISHED 
... tor of 2 and to optimize the usage of system resources (such as battery power) from 20% to 35% with respect to conventional power management strategies, while preserving the target Quality of Service.STMicroelectronics will obtain faster time-to-market by exploiting improved programmability and demonstrable adaptability of the P2012 to multi-application sce-narios. Synopsys will consider the inclu ...
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 8

 FINISHED 

Programming for Future 3D Architectures with Many Cores (PRO3D)

Start date: Jan 1, 2010, End date: Dec 31, 2012,

The shift from systems-on-chip (SoC) to manycore architectures brings new hardware and software challenges ranging from seamless integration of processors, memories the design of modular systems and application software to run on massively parallel and scalable platforms. Manycores will benefit tremendously from 3-dimensional (3D) integration technology that enables distribution in space of comput ...
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 8

 FINISHED 

High Performance and Embedded Architecture and Compilation (HiPEAC)

Start date: Feb 1, 2008, End date: Jan 31, 2012,

Due to technology limitations, the domain of high-performance processors is experiencing a radical shift towards parallelism through on-chip multi-cores and chip customization leading to heterogeneous multi-core systems. Furthermore, the commodity market, the supercomputing market and the embedded market are increasingly sharing the same challenges, leading to convergence of the three markets.The ...
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 14

 FINISHED 
NANOSIL Network of Excellence aims to integrate at the European level the excellent European research laboratories and capabilities in order to strengthen scientific and technological excellence in the field of nanoelectronic materials and devices for terascale integrated circuits (ICs) and disseminate the results in a wide scientific and industrial community.NANOSIL will explore and assess the sc ...
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 38