Picosun Oy
Looking for Partnership Looking for Extra EU Funds
Picosun, developer of ALD (Atomic Layer Deposition) tools and processes is seeking looking for partners and applications, for EU-projects, such as:
ICT-02-2016 Thin, Organic and Large Area Electronics, e.g. flexible barriers
ICT-03-2016 SSI - Smart System Integration, e.g. MEMS alike structures
FOF-03-2016 Zero-defect strategies at system level for multi-stage manufacturing in production lines, Pinhole free thin-films or catalytic surfaces
-- To demonstrate ALD for new applications. Further, our interest is to develop ALD further for IC processes.
ALD can be used to deposit such as metal-oxides, metals, nitrides, sulfides and graphene on 3D surfaces. ALD is a vacuum process, for wafer, 3D parts, R2R webs and powders, from <1Å to 100's nm. As one cycle equals usually ~1Å, each cycle could be different material, and huge number of possible material combinations are possible. In addition of single atomic deposition, the subclass of MLD (Molecular Layer Deposition) can also be used to e.g. deposit some specific organic chains on the surface. Further, PEALD (Plasma Enhanced Atomic Layer Deposition) enable reaction of surface with neutral radicals, enabling wider range or low temperature processes.
Picosun is an SME, experienced in EU-project, and in effective exploitation of the project results. We hope to be the partner, enabling the key R&D and transfer to industrial production.