POWER SoC With Integrated PassivEs
Start date: Oct 1, 2012,
End date: Mar 31, 2016
Europe is a world leader in innovative automotive systems with competencies covering the full supply chain from the main OEMs (Audi, BMW, Daimler, Fiat, PSA, RSA, VW) to Tier1 suppliers (Bosch, Continental, Magneti Marelli) to leading semiconductor companies (Infineon, ST). The vision for electronic automotive control units in 2020 is that the battery will supply multi-core µControllers via multiple power supplies using an on-chip, granular power management system architecture, known as PowerSoC (Power Supply on Chip). The PowerSwipe proposal will address a key roadblock for PowerSoC by, for the first time, miniaturising and integrating state-of-the-art, high density trench capacitor substrate technology with novel thin film magnetics on silicon to deliver a multi-component LC (inductor-capacitor) interposer which will be combined, in a 3D heterogeneous stack, using eWLB technology, with the µController chip. To achieve this miniaturisation of the power passives, the switching frequency of the switched mode dc-dc converter needs to be increased from the traditional 1 to 5 MHz space (with 90%+ converter efficiency) into the 20MHz to 100MHz+ range, at which point the footprint of the power passives is comparable to the footprint of the individual on-chip DC-DC converter blocks (i.e. 1 to 2mm2). PowerSwipe will deliver a European supply chain for PowerSoC by addressing the challenges of system design, engineering, technology and manufacturability of integrated power management systems or PowerSoC (Power Supply on Chip) for nanoCMOS System on Chip (SOC).
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