Laser Digital Micro-Nano fabrication for Organic E.. (LaserMicroFab)
Laser Digital Micro-Nano fabrication for Organic Electronics and Sensor applications
Start date: Mar 1, 2013,
End date: Feb 28, 2017
LaserMicroFab proposes a joint research programme exploiting on the knowledge and expertise of two academic partners (National Technical University of Athens (NTUA) and CNRS-LP3) and one SME, Oxford Lasers (OL) through inter-sectorial exchange of knowledge, networking activities and training in the areas of advanced laser processing for organic electronic devices and biosensors. The goal for this project is to develop Laser digital micro-fabrication processes such as selective laser micro and nano-patterning, laser micro-curing and laser micro-printing for precision patterning of complex materials, such as metallic nanoparticle (NP) inks and organic materials. The developed laser processes will be employed for the micro-curing of metallic nanoparticle (NP) interconnects to achieve submicron spatial resolution, for the nanostructuring of ultrathin (<50 nm) layers and for the printing of organic semiconductors for electronics and/or photovoltaics applications. Moreover, patterns of biomolecules will be printed using the laser micro-printing process with high spatial resolution (<10 μm) without compromising the viability of these delicate structures. The integration of laser micro-fabrication processes and the design of a laser platform based on the Oxford Lasers equipment (DPSS pulsed lasers ranging from nanosecond (ns) to femtosecond (fs) duration pulses) will be achieved, in collaboration with the research groups from NTUA and the CNRS-LP3.The success of this project will have a great impact on the market potential of Oxford Lasers’ products and the research excellence of NTUA and CNRS-LP3 in the fields of materials engineering, biotechnology and chemical engineering, ensuring its multidisciplinary character. At the end of this project, a full set of parameters will be established and optimised as an innovative tool for material processing and will be further exploited for new applications and market areas.
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