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Joint Equipment and Materials for System-in-Package and 3D-Integration (JEMSIP_3D)
Start date: 01 Apr 2009, End date: 01 Mar 2012 PROJECT  FINISHED 

The objective of the project « Joint Equipment & Materials for System-in-Package and 3D Integration » is to validate technological solutions for the fabrication of high value-added heterogeneous components and systems.This theme, generally known as “More Than Moore”, intends to gather within a unique system a set of various functions, implemented with elementary components, those generally being from various origins and technologies (memories, logic, sensors, actuators, wireless communication…).Numerous feasibility studies around the world already concluded positively at the R&D level, and Europe has advantages in the supply chain and a leading position that it should maintain.For that purpose, the JEMSiP_3D project gathers the majority of the European actors of the domain: material providers, laboratories, research centers and manufacturers of equipments, components and systems.The project is structured around 5 themes:·Methodology and evaluation tools to integrate elementary components in 3D systems.·3D technologies and integration processes onto materials and non-Si substrates·3D technologies and integration processes onto Si, using processes closely deriving from microelectronics·Test equipment, measurement protocols and reliability methodologies for integrated 3D systems·Performance evaluation and equipment validation for volume production equipment and generic manufacturingThis horizontal project targeting the implementation of production tools for 3D integration and associated technologies will be a direct support to the projects presented to the 6 applicative sub-programs defined in ENIAC work program.
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