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Highly Flexible Printed ITO-free OPV Modules (HIFLEX)
Start date: Jan 1, 2010, End date: Dec 31, 2012 PROJECT  FINISHED 

HIFLEX aims to develop a cost-effective Highly Flexible Printed ITO-free OPV module technology that matches the particular requirements of mobile and remote ICT applications in terms of efficiency under different light conditions, lifetime, cost structure, power to weight ratio and mechanical flexibility. The project intends to accelerate the exploitation of this OPV technology for a wide variety of ICT products in the mobile electronics market. An application-driven research approach will be followed by developing large area, solution processable ITO free OPV using scalable, reproducible and commercially viable printing and coating techniques enabling the low cost production of highly flexible and lightweight OPV products. At the same time it guarantees the technological compatibility with other printed electronic components and systems. The high flexibility and lower costs will be addressed by the solar cell module design we intend to bring into production. The partnership consists of: one SME (Dr Schenk) with invaluable expertise in the inline process and quality control of R2R processed PV, one industry (Agfa) with market tested experience on photographic development of Ag grid lines, PEDOT antistatic coatings and large scale coating as well as developing innovative coating solutions, and five research institutes (ECN, ISE, Risø DTU, Holst centre, MatRI) with a technology focus and with complementary expertise in the field of device and module engineering, up-scaling and large area printing and long-term lifetime testing. We anticipate that this project will result in the demonstration of a new scalable, low cost, solution processable photovoltaic technology and will therefore form the basis of a potentially substantial business opportunity for Europe aiming at developing a new solar cell product with cost and payback characteristics strongly advantaged over existing technologies.

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