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HERMES – High Exponential Rise in Miniaturized cantilever-like Sensing (HERMES)
Start date: Feb 1, 2013, End date: Jan 31, 2018 PROJECT  FINISHED 

"Miniaturized cantilever–like sensors have evolved rapidly. However, when it comes to major breakthroughs in both fundamental studies as well as commercial applications these sensors face severe challenges: i) reliability – often only one or two measurements are performed for the same conditions due to very slow data generation and the results are rarely confirmed by orthogonal sensing technologies, ii) sensitivity – in many applications the need is now for ultra-low sensitivities, iii) reproducibility – very few results have been reported on reproducibility of these sensors iv)throughput –extremely slow and tedious read-out technologies. In order to take a great leap forward in cantilever-like sensing I suggest a new generation of simplified and optimized cantilever-like sensing structures implemented in a DVD based platform which will specifically address these issues.My overall hypothesis is that the true potential of these exciting sensors can only be released when using a simple and reliable read-out system that allows us to focus on the mechanical performance of the sensors. Thus we will keep the sensors as simple as possible. The DVD readout makes it possible to generate large amount of data and to focus on mechanics and the interplay between mechanics, optics and electrochemistry. It will be a technological challenge to realize a robust and reliable DVD platform, that facilitates optical read-out as well as actuation. The DVD platform will enable a fast and iterative development of hybrid cantilever-like systems which draw upon our more than 10 years experience in the field. These sensors will be realised using Si and polymer based cleanroom fabrication. Focus is on design, fabrication, characterization and applications of cantilever-like sensors and on DVD inspired system integration. By the end of HERMES we will have a unique platform which will be the onset of many new types of specific high –throughput applications and sensor development projects."
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