Search for European Projects

4 European Projects Found

Searched on 125080 European Projects

 FINISHED 

Metrology for future 3D-technologies (METRO4-3D)

Start date: Feb 1, 2016, End date: Jan 31, 2019,

Within the food chain of equipment delivery for the semiconductor industry, Europe has kept a very strong position in the metrology area with many companies establishing themselves as main leaders in the field. Hence in line with the objectives of the ICT25 call for innovation action to overcome the (initial) barriers for the successful commercialization of novel European products, this project a ...
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 9

 FINISHED 

Semiconductor Equipment Assessment Leveraging Innovation (SEAL)

Start date: Jun 1, 2010, End date: Sep 30, 2013,

Description Seal is an EC-funded project covering semiconductor equipment assessment to strengthen the European semiconductor equipment industry. SEAL is an integrated project consisting of 17 equipment assessment sub-projects in the area of semiconductor manufacturing equipment. The assessment th ...
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 39

 FINISHED 

Efficient Silicon Multi-Chip System-in-Package Integration - Reliability, Failure Analysis and Test (ESIP)

Start date: May 1, 2010, End date: Apr 1, 2013,

The ENIAC JU project ESiP is addressing the issues of reliability, failure analysis and testing in innovative system-in-package (SiP) solutions. Highly integrated systems with greater miniaturisation and increased functionality open new markets and improve the quality of life through a wide range of applications. In particular, higher systems integration technologies using multi-chip packaging, th ...
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 40

 FINISHED 

European 450mm Equipment & Materials Initiative (EEMI 450)

Start date: Apr 1, 2010, End date: Mar 1, 2013,

Large-scale semiconductor fabrication is now standardised on 300mm diameter wafers. However, as demand grows and node dimensions diminish, major chipmakers are considering offsetting the growing costs of miniaturisation by increasing wafer size to 450mm to cut cost per produced die. A prerequisite is the availability of the required quality wafers and equipment able to handle larger wafers. The EN ...
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 27