Search for European Projects

9 European Projects Found

Searched on 125080 European Projects

 FINISHED 

Zero- and First-level Packaging of RF-MEMS (MEMSPACK)

Start date: Jun 1, 2008, End date: Feb 29, 2012,

... passives, like switches, high-Q resonators and tunable filters.Today, the commercialization of RF-MEMS, is greatly hampered by two critical success factors, namely, the development of an appropriate packaging technology and solving the reliability issues. There has not been sufficient effort towards solving these issues in Europe. The proposed MEMPACK project tackles the packaging issue. The proj ...
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 8

 FINISHED 

Silicon-based Ultra-Compact Cost-Efficient System Design for mm-Wave Sensors (SUCCESS)

Start date: Dec 1, 2009, End date: May 31, 2013,

... enable miniaturized wireless sensors systems with the size and form factor of an IC package. However several challenges make it difficult to arrive at real low cost. Firstly no true low-cost mm-wave packaging technologies with antenna-integration are available. Furthermore challenges in mm-wave SoC design arise in form of imprecise modelling and device variations. In addition production testing a ...
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 9

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Efficient Silicon Multi-Chip System-in-Package Integration - Reliability, Failure Analysis and Test (ESIP)

Start date: May 1, 2010, End date: Apr 1, 2013,

...iaturisation and increased functionality open new markets and improve the quality of life through a wide range of applications. In particular, higher systems integration technologies using multi-chip packaging, through-silicon via technologies or package-stacking approaches are growing in importance. Market studies show that SiP devices will have an average growth of 10 to 20% per year over the ne ...
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 40

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Smart and Compact Battery Management System Module \nfor Integration into Lithium-Ion Cell for Fully Electric Vehicles (Smart-LIC)

Start date: May 1, 2011, End date: Oct 31, 2014,

... The ambitious objectives are obtained by realizing the BMS module as a system-in-package (SiP) directly integrated into the lithium-ion cell for use in electric and hybrid vehicles by using advanced packaging technologies. Early demonstration of the technology will be made by preparing specific battery packs to be installed both on a vehicle.
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 11

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Partitioning and Modeling of SiP (PARSIMO)

Start date: Mar 1, 2011, End date: Jun 1, 2014,

...magnitude. In addition, partitioning algorithms will be investigated to enable cost, performance and power optimisation at early design stages. Furthermore, procedures for the direct data exchange to packaging tools will be developed, so that a complete design flow can be established as basis for automated, fast and cost-efficient manufacturing of SiP based products. PARSIMO aims at initiating sta ...
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 9

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Photonics for High-Performance, Low-Cost & Low-Energy Data Centers, High Performance Computing Systems:Terabit/s Optical Interconnect Technologies for On-Board, Board-to-Board, Rack-to-Rack data links (PhoxTroT)

Start date: Oct 1, 2012, End date: Sep 30, 2016,

...e optical PCBs, chip- and board-to-board connectors) that can be used for a broad range of applications, extending performance beyond Tb/s and reducing energy by more than 50%.. a unified integration/packaging methodology as a cost/energy-reduction factor for board-adaptable 3D SiP transceiver and router optochip fabrication.. the whole "food-chain" of low-cost and low-energy interconnect technolo ...
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 22

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Preparing R2 extension to 300mm for BCD Smart Power (R2POWER300)

Start date: Jul 1, 2015, End date: Jun 30, 2018,

...ss leader on smart power ICs.3. Advanced System in Packages: some SiP activity will be performed, with specific reference to Sintering based die-attach, thermal analysis and dedicated packaging solution for high density ALD capacitors.
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 10

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THz Muti-Gb/s System in Package (TMGSiP)

Start date: Apr 1, 2015, End date: Mar 31, 2017,

...S technology. This will be done with a completely new cross-cutting design methodology for silicon-MMIC, e.g. the development of wideband receiver and transmitter, including on-chip antenna and novel packaging concepts. This will enable a big improvement in the functionality (complexity of RF MMICs), performance (data rate), component size (fully-integrated compact MMIC with integrated antennas), ...
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 1

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An integrated pilot line for micro-fabricated medical devices (InForMed)

Start date: Jun 1, 2015, End date: May 31, 2018,

The goal of the InForMed project is to establish an integrated pilot line for medical devices. The pilot line includes micro-fabrication, assembly and even the fabrication of smart catheters. The heart of this chain is the micro-fabrication and assembly facility of Philips Innovation Services, which will be qualified for small/medium-scale production of medical devices. The pilot facility will be ...
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