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Investigation of Si wafer damage in manufacturing processes (SIDAM)

Start date: Jan 1, 2008, End date: Jun 30, 2011,

Wafer handling in semiconductor manufacturing introduces microcracks at the wafer edge. During thermal processing, some of these grow into slip bands; on rapid thermal processing some of these grow into cracks, shattering the wafer and disrupting manufacture. Dense slip bands also lead to yield loss by locally increasing diffusion rates. Breakage losses alone were of the order of €2.5M p.a. for a ...
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