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2 European Projects Found

Searched on 125080 European Projects

 FINISHED 

Thermoplastically deformable circuits for embedded randomly shaped electronics (TERASEL)

Start date: Oct 1, 2013, End date: Sep 30, 2016,

The overall aim of the TERASEL project is the development, the industrial implementation and the application in a wide range of domains of large area, cost-effective, randomly shaped electronics and sensor circuit technologies. More specifically the TERASEL objectives are the following :• To develop a basic technology platform for rigid large-area randomly shaped electronic circuits. Key common fe ...
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 16

 FINISHED 

Ultra thin chip integration process for low cost communicative polymer foils (Chip2Foil)

Start date: Jan 1, 2010, End date: Apr 30, 2013,

Chip2Foil aims at realising a technology platform for low cost placement and interconnection of ultra thin chips on polymer foils, within a high volume, reel-to-reel production concept. This competence allows realising a broad variety of disposable communicative packages. These packages provide increased interaction between the packed product, the package and the user through near-field communicat ...
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 8