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HIgh throughPut LasER processing of DIamond and Silicon (HIPERDIAS)

Start date: Feb 1, 2016, End date: Jul 31, 2019,

Driven by the end-users requirements and needs, the main objective of the HIPERDIAS project is to demonstrate high throughput laser-based manufacturing using high-power, high-repetition rate sub-1ps laser. Although the laser system to be developed within HIPERDIAS can address other material processing applications, the focus here will be 3D structuring of silicon at high-speed, precision processin ...
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