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The central project aims are to:Implement a novel low cost, resource efficient and sustainable process by combining electrochemical reactor engineering with innovative ultrasound agitation to enable selective metallisation of microscale devices, components and printed circuit boards (PCBs) without requiring photolithography.Design, integrate and scale-up the technology to enable successful, econom ...

"To investigate the scope, extent and factors causing black pad and related problems on printed circuit boards with an electroless nickel / immersion gold (ENIG) solderable finish . To develop a non-destructive test method to show the presence of black pad. To develop and test lower cost, less aggressive surface protection chemistries as replacements for conventional ENIG using both aqueous and io ...