8 European Projects Found
Searched on 125080 European Projects
FINISHED
Development of 2nd Generation Biorefineries – Production of Dicarboxylic Acids and Bio-based Polymers Derived Thereof (BIOREFINE-2G)
Start date: Oct 1, 2013, End date: Sep 30, 2017,
The existing 2nd generation biorefineries utilize less than 20% of the biomass feedstock for ethanol production, and major side-streams are produced such as pentose and lignin waste streams, that are respectively used for biogas and energy production. Converting the carbon from these waste streams into added-value products would increase the otherwise low profitability and improve the environmenta ...
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9
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A novel technology for producing bio-based synthetic textile fibres from biomass-derived furanic monomers (ECOLASTANE)
Start date: Mar 1, 2013, End date: Feb 29, 2016,
"European Chemicals Industry supplies European Textile & Clothing industry with textile fibres, 75% of which are synthetic (polyester, elastane, nylon). The European Biomass Industry needs to gain market share to the petrochemical industry as supplier of sustainable biomaterials to the Chemicals Industry. More than 99.9% of the world synthetic fibers are made of non-renewable petrochemical resourc ...
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9
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Study of Strongly Interacting Matter (HADRONPHYSICS3)
Start date: Jan 1, 2012, End date: Dec 31, 2014,
The Project promotes the access to five European Research Infrastructures, and it is structured into nine Networking Activities, plus the Management of the Consortium, and fourteen Joint Research Activities.The Project will profit of the success of the previous HadronPhysics project in FP6 and the current HadronPhysics2 in FP7, and originates from the initiative of more than 2.500 European scienti ...
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52
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Oxide Materials Towards a Matured Post-silicon Electronics Era (Orama)
Start date: Oct 1, 2010, End date: Sep 30, 2014,
Orama is on the development of new high performance multifunctional oxide based electronic materials, processable at low temperatures, including flexible substrates that have the potential to catapult the electronics industry into a new era of growth. Orama will develop, analyze and utilize these new materials and techniques to investigate into device concepts highlighting the potential of oxides ...
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18
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Developing the Framework for an Epidemic Forecast Infrastructure (EPIWORK)
Start date: Feb 1, 2009, End date: Jul 31, 2013,
In recent years a huge flow of quantitative social, demographic and behavioural data is becoming available spurring the quest for innovative technologies that can improve the traditional disease-surveillance systems, providing faster and better localized detection capabilities and resulting in a broad practical impact. Improved ICT techniques and methodologies support the inter-linkage and integra ...
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12
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Information and Communication Technologies \nfor the Full Electric Vehicle (ICT4FEV)
Start date: May 1, 2010, End date: Sep 30, 2012,
Description
Coordination ActionICT4FEV is a Coordination Action in the framwork of the European Green Cars Initiative. The focus of the project is on enabling the full electric vehicle (FEV) by opening new technology paths towards energy efficiency, functionality and usability that are complementary to future advances in performance of ba ...
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7
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Study of Strongly Interacting Matter (HadronPhysics2)
Start date: Jan 1, 2009, End date: Dec 31, 2011,
The Project promotes the access to five European Research Infrastructures, and it is structured intop eight Networking Activities, plus the Management of the Consortium, and fourteen Joint Research Activities. The Project represents the continuation of the successful HadronPhysics project in FP6 and originates from the initiative of more than 2.500 European scientists working in the field of hadro ...
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46
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Nano Packaging Technology for Interconnect and Heat Dissipation (NANOPACK)
Start date: Nov 1, 2007, End date: Sep 30, 2011,
One of the major limitations to continued performance increases in the semiconductor and power electronics industries is integration density and thermal management. Continued transistor downscaling is quickly reaching its limits forcing a new focus on heterogeneous integration and 3D packaging technologies to continue performance improvements by reducing interconnect length between memory and mult ...
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