3 European Projects Found
Searched on 125080 European Projects
FINISHED
Modular interposer architecture providing scalable heat removal, power delivery, and communication (CarrICool)
Start date: Jan 1, 2014, End date: Dec 31, 2016,
Modular interposer architecture providing scalable heat removal, power delivery and communicationCarrICool will deliver a game-changing 3D packaging platform for scale-up of future, many-core, Exascale computing systems. The project will also develop a strategic supplier base in Europe for high-end HPC components and systems integration capabilities in the Exascale era. In CarrICool, advanced More ...
Read Project
9
Partners Participants
FINISHED
Innovative Nano and Micro Technologies for Advanced Thermo and Mechanical Interfaces (NANOTHERM)
Start date: Sep 1, 2012, End date: Feb 29, 2016,
Future electronic power devices and packages will need to demonstrate more performance and functionality at reduced cost, size, weight, energy consumption and thermal budget. Further, increasing reliability demands have also to be met by industry to be competitive in this growing multi-billion Euro market of heterogeneously integrated systems.To respond to these challenges, new innovative nano- an ...
Read Project
18
Partners Participants
FINISHED
Functional joining of dissimilar materials using directed self-assembly of nanoparticles by capillary-bridging (HYPERCONNECT)
Start date: Jan 1, 2013, End date: Dec 31, 2015,
Tomorrows micro-electronic devices will have to show more functionality and performance at smaller form factor, lower cost and lower energy consumption in order to be competitive on this multi-billion dollar market. Advanced system integration is thus inevitable, a trend bound to joining dissimilar materials with new packaging technologies. These processes must enable lower thermal resistances and ...
Read Project
