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Enable power technologies on 300mm wafer diameter (EPT300)

Start date: Apr 1, 2012, End date: Mar 1, 2015,

EPT 300 aims to be a decisive step forward to strengthen Europe’s leading position in power semiconductor technologies and More-than-Moore manufacturing capabilities relating to energy efficient electronic solutions. Power semiconductor devices fabricated in a European leading pilot line for 300mm wafer production are the scope of the project, for which manufacturing excellence, cost competitivene ...
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