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Improved Thermal Properties of Computing Platforms for Next-Generation Avionics [SAT] - JTI-CS2-2018-CfP08-SYS-03-17
Deadline: 12 Jul 2018   CALL EXPIRED

EU logo mono EC - Horizon 2020

 Aerospace Technology
 Electronics and Microelectronics
 Aeronautics Industries

Specific Challenge:

The proposed activity shall investigate, develop, and validate emerging thermal-aware SW-based techniques that will reduce operational temperature of electronic circuits. The expected impact of the improved thermal performance will both improve computing performance and will reduce size and weight of electronics due to relaxed dissipation requirements. Please refer to the full topic descriptions document published in this call.

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