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High density Electrical connectors - JTI-CS2-2017-CFP06-LPA-03-12
Deadline: Jun 21, 2017  

 Aerospace Technology
 Electronics and Microelectronics
 Aeronautics Industries

Specific Challenge:

The topic aims at defining new type of connectors addressing Modular, low cost and high density connection for avionics application. These new connectors will be designed, manufactured and tested onto a Remote Data Power Cabined studied in the frame of the Platform 3 of LPA IADP. The applicant will benefit of this topic to prepare a future standard of connectors. Please refer to the full and formal topic descriptions published in this call.

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