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3 European Projects Found

Searched on 125080 European Projects

 FINISHED 

Support Action for 450mm topics establishing a Bridge between European EM entities and IDMs, Foundries and Entities Worldwide (Bridge450)

Start date: Nov 1, 2013, End date: Oct 31, 2016,

Five major global semiconductor companies are working in the G450C consortium based in Albany N.Y. to introduce 450mm wafer semiconductor processing and are now installing the first wave of 450mm prototype systems. Intel and TSMC lead this effort with published roadmaps showing pilot lines in 2016, production in 2018. Samsung will soon follow which will force GlobalFoundries, SK Hynix, Toshiba, UM ...
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 12

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Coordination Action to enable an effective European 450 mm Equipment & Materials Network (ENABLE450)

Start date: Nov 1, 2012, End date: Oct 31, 2016,

5 major global semiconductor companies Intel, Samsung, TSMC, IBM and Global Foundries, have decided to work closely together to bring 450 mm semiconductor processing to a mature level, within a consortium called G450C. This operation, based in Albany N.Y., is currently ordering and installing the first wave of 450 mm systems. The major drivers of this effort are Intel and TSMC, which have provide ...
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 13

 FINISHED 

Semiconductor Equipment Assessment Leveraging Innovation (SEAL)

Start date: Jun 1, 2010, End date: Sep 30, 2013,

Description Seal is an EC-funded project covering semiconductor equipment assessment to strengthen the European semiconductor equipment industry. SEAL is an integrated project consisting of 17 equipment assessment sub-projects in the area of semiconductor manufacturing equipment. The assessment th ...
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