Search for European Projects

6 European Projects Found

Searched on 125080 European Projects

 FINISHED 

Ultra-Low PoweR technologIes and MEmory architectures for IoT (PRIME)

Start date: Dec 1, 2015, End date: Mar 31, 2019,

The goal of the PRIME project is to establish an open Ultra Low Power (ULP) Technology Platform containing all necessary design and architecture blocks and components which could enable the European industry to increase and strengthen their competitive and leading eco-system and benefit from market opportunities created by the Internet of Things (IoT) revolution. Over 3 years the project will deve ...
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 19

 FINISHED 

Energy Efficient Converters using GaN Power Devices (E2COGAN)

Start date: Apr 1, 2013, End date: Mar 31, 2016,

The E2COGaN project will target the demonstration of GaN-on-Si as a disruptive power device technology platform through the whole value chain up to demonstrators with high industrial, societal and environmental relevance. Its innovative character will be proven through a well-balanced and application specific trade-off between the “corner” benefits given by higher efficiency, higher switching freq ...
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 25

 FINISHED 
"ICT-based service and product innovation is curtailed by the growing vertical chain of dependence on poorly interoperable proprietary technologies in Europe. This issue was identified to have high impact on European innovation productivity by the Report of the Independent Expert Group on R&D and Innovation, commonly known as the Aho-report. The report demanded incentives for the convergence of sh ...
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 28

 FINISHED 
New safety standards, such as ISO 26262, present a challenge for companies producing safety-relevant embedded systems. Safety verification today is often ad-hoc and manual; it is done differently for digital and analogue, hardware and software.The VeTeSS project will develop standardized tools and methods for verification of the robustness of safety-relevant systems, particularly against transient ...
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 26

 FINISHED 
Electronic devices of the latest generations, being those integrated circuits or discrete components, are often required to operate in harsh environmental conditions, where the temperature may reach over hundred degrees centigrade. Obviously, this has negative impact on several parameters of the electronic devices, ranging from slow-down and transient, recoverable errors to permanent failures and ...
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 21

 FINISHED 

MAsk less lithoGraphy for IC manufacturing (MAGIC) (MAGIC)

Start date: Jan 1, 2008, End date: Dec 31, 2010,

Description MAGIC has supported the development of e-beam based maskless lithography technology in Europe: Two parallel lithography tool developments for 32nm CMOS and beyond and on lithography infrastructure.In the CMOS manufacturing environment, the mask-based optical lithography technique is up to now driving solution to deal with all ...
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 19