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10 European Projects Found

Searched on 125080 European Projects

 FINISHED 

Rf Engineered substrates to FostER fEm performaNCE (REFERENCE)

Start date: Dec 1, 2015, End date: May 31, 2019,

The REFERENCE project aims to leverage a European leading edge Radio Frequency (RF) ecosystem based on RF Silicon On Insulator (SOI) disruptive technology, perceived as the most promising to address performance, cost and integration needs for RF Front End Modules (FEMs)s.The project targets to develop over the next 3 years, innovative solutions from material, engineered substrates, process, design ...
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 18

 FINISHED 

Ultra-Low PoweR technologIes and MEmory architectures for IoT (PRIME)

Start date: Dec 1, 2015, End date: Mar 31, 2019,

The goal of the PRIME project is to establish an open Ultra Low Power (ULP) Technology Platform containing all necessary design and architecture blocks and components which could enable the European industry to increase and strengthen their competitive and leading eco-system and benefit from market opportunities created by the Internet of Things (IoT) revolution. Over 3 years the project will deve ...
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 19

 FINISHED 

NANOmaterials: STRategies for Safety Assessments in advanced Integrated Circuits Manufacturing (NanoStreeM)

Start date: Jan 1, 2016, End date: Dec 31, 2018,

Understanding properties of nanoparticles (and in general of nano-functionalized materials) and how they behave in living systems is a relatively new area of scientific study. The scientific community has not yet been able to derive harmful properties of nanomaterials from the properties of the bulk material. So a precautionary approach is required when handling and using these materials in circum ...
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 15

 FINISHED 

Seven Nanometer Technology (SeNaTe)

Start date: Apr 1, 2015, End date: Mar 31, 2018,

The SeNaTe project is the next in a chain of thematically connected ENIAC JU KET pilot line projects which are associated with 450mm/300mm development for the 12nm and 10nm technology nodes. The main objective is the demonstration of the 7nm IC technology integration in line with the industry needs and the ITRS roadmap on real devices in the Advanced Patterning Center at imec using innovative devi ...
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 41

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Which Architecture Yields Two Other Generations Of Fully depleted Advanced Substrate and Technologies (WAYTOGO FAST)

Start date: May 1, 2015, End date: Apr 30, 2017,

...l the following node transistor architecture. Europe is at the root of this breakthrough technology in More Moore law. The project aims at establishing a distributed pilot line between 2 companies: - Soitec for the fabrication of advanced engineered substrates (UTBB: Ultra Thin Body and BOx (buried oxide)) without and with strained silicon top film. - STMicroelectronics for the development and in ...
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 32

 FINISHED 

European 450mm Equipment Demo Line (E450EDL)

Start date: Oct 1, 2013, End date: Sep 30, 2016,

The aim of the E450EDL project is to continue the engagement of the European semiconductor equipment and materials industry in the 450mm wafer size transition that started with the ENIAC JU EEMI450 initiative and proceeded with subsequent projects funded with public money, amongst others NGC450, SOI450, EEM450PR. The demo line resulting from this project will be such that it will enable first crit ...
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 44

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DEVELOPMENT OF ADVANCED GAN TECHNOLOGIES (AGATE)

Start date: Apr 1, 2013, End date: Mar 31, 2016,

According to the High-Level Experts Group (HLG) micro and nanoelectronics are essential for all goods and services which need intelligent control in all innovative sectors and are therefore identified as Key Enabling Technologies (KET). Gallium Nitride is an advanced semiconductor material at the heart of three strategic issues, advanced materials, photonics and micro/nanoelectronics. The deploym ...
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 10

 FINISHED 

Pilot Lines for Advanced CMOS EmbodimentS in 2x nodes, Built in Europe (PLACES2BE)

Start date: Dec 3, 2012, End date: Dec 31, 2015,

...is an integral part of the Horizon 2020 strategy.Consortium: PLACES2BE Pilot line gathers 27 experienced partners, including industry leaders such as GLOBALFOUNDRIES, ARM, STEricsson, SOITEC, MENTOR Graphics along the microelectronics value chain, SMEs such as Open Engineering, eSilicon, GSS, Axiom, IBS, RTOs such as the Fraunhoger Gesellschaft, IMEC, and LETI, and several academic teams located i ...
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 22

 FINISHED 

European 450mm Equipment & Materials Initiative (EEMI 450)

Start date: Apr 1, 2010, End date: Mar 1, 2013,

Large-scale semiconductor fabrication is now standardised on 300mm diameter wafers. However, as demand grows and node dimensions diminish, major chipmakers are considering offsetting the growing costs of miniaturisation by increasing wafer size to 450mm to cut cost per produced die. A prerequisite is the availability of the required quality wafers and equipment able to handle larger wafers. The EN ...
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 27

 FINISHED 

NEW APPLICATIONS FOR CPV'S: A FAST WAY TO IMPROVE RELIABILITY AND TECHNOLOGY PROGRESS (NACIR)

Start date: Jan 1, 2009, End date: Dec 31, 2012,

"The main goal of this proposal is to join together the owners of the most advanced CPV technology, with respect to the state of the art, in order to research from its leading position new applications for CPV systems. In addition to opening up new markets, it will unveil possible sources of failure in new environments outside Europe, in order to assure component reliability. The proposed project ...
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 7