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Material Development for Double exposure and Double patterning (MD3)

Start date: Dec 1, 2007, End date: Nov 30, 2009,

Double patterning lithography has been identified as one of the most promising solutions for the 32nm node patterning. This technique refers to a two step process where a first pattern is exposed, developed and sometimes etched and a second pattern is also exposed, developed and transferred on the top of the first one. For the moment, several issues still need to be addressed for enabling the Doub ...
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