4 European Projects Found
Searched on 125080 European Projects
FINISHED
Nano-Enabled Conducting Materials Accelerating Device Applicability (NECOMADA)
Start date: Jan 1, 2017, End date: Dec 31, 2019,
The project targets the incorporation of advanced functional materials to deliver customised conductive inks and flexible adhesives compatible with high volume manufacturing platforms. Specifically the development of these enabling materials will support high speed roll to roll integration of hybrid and large area electronics to address internet of things opportunities.The consortium will integra ...
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14
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High Performance Laser-based Additive Manufacturing (HIPERLAM)
Start date: Nov 1, 2016, End date: Oct 31, 2019,
HIPERLAM is an SME driven Research and Innovation Action (RIA) well-aligned to the Factories of the Future (FoF) Initiative with a strong emphasis upon demonstrating superior cost and speed performance in end-to-end processes featuring laser-based additive manufacturing in two key applications requiring high resolution printed conductive metallic lines, namely laser printed RFID antenna and laser ...
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8
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Printed Intelligent NFC Game cards and packaging (PING)
Start date: Jan 1, 2015, End date: Dec 31, 2017,
...haracteristics. Moreover, one-time programmable memory (PROM) will enable additional functionality. NFC chip development will be ready for implementation in the “up-scaled” production facility at Pragmatic Printing (>100Mn chips/year). As a result, the PING consortium represents the value chain (design, manufacturing, integration, assembly and conversion) of NFC-enabled products in Europe and will ...
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7
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Using existing methods to develop a modular, integrated and autonomous ‘Factory-in-a-box’ production line for manufacturing high volumes of flexible integrated logic circuits (FlexLogIC)
Start date: Sep 1, 2015, End date: Nov 30, 2015,
We are Pragmatic Printing Ltd; we are pioneering the innovation in the field of flexible printed electronics. We are recognised by global firm ARM HOLDINGS for our disruptive and compelling solution for embedded connectivity in everyday objects. Our ‘flexICs’ are revolutionary integrated circuits manufactured on organic (plastic) substrates (instead of silicon) through our novel processes. Our fle ...
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