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8 European Projects Found

Searched on 125080 European Projects

 FINISHED 

Seven Nanometer Technology (SeNaTe)

Start date: Apr 1, 2015, End date: Mar 31, 2018,

The SeNaTe project is the next in a chain of thematically connected ENIAC JU KET pilot line projects which are associated with 450mm/300mm development for the 12nm and 10nm technology nodes. The main objective is the demonstration of the 7nm IC technology integration in line with the industry needs and the ITRS roadmap on real devices in the Advanced Patterning Center at imec using innovative devi ...
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 41

 FINISHED 

PANACHE

Start date: Jan 2, 2014, End date: Jan 2, 2018,

Pilot line for Advanced Nonvolatile memory technologies for Automotive microControllers, High security applications and general Electronics :The PANACHE project objective is to set-up a pilot line for embedded Flash technology design and manufacturing platform for the prototyping of innovative µcontrollers in Europe.The current 40nm technology platform as well as the already defined 55nm technolog ...
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 21

 FINISHED 

European 450mm Equipment Demo Line (E450EDL)

Start date: Oct 1, 2013, End date: Sep 30, 2016,

The aim of the E450EDL project is to continue the engagement of the European semiconductor equipment and materials industry in the 450mm wafer size transition that started with the ENIAC JU EEMI450 initiative and proceeded with subsequent projects funded with public money, amongst others NGC450, SOI450, EEM450PR. The demo line resulting from this project will be such that it will enable first crit ...
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 44

 FINISHED 

Enhanced Power Pilot Line - EPPL (EPPL)

Start date: Apr 1, 2013, End date: Mar 31, 2016,

A sustainable and competitive European power semiconductor industry is essential to support the megatrend developments formulated in the Europe 2020 strategy - climate change, energy security, food security, and health and aging population. In practically all these areas, power semiconductors play a vital role. Thus, it is of paramount importance to defend and further extend Europe’s leading posit ...
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 33

 FINISHED 

Pilot Lines for Advanced CMOS EmbodimentS in 2x nodes, Built in Europe (PLACES2BE)

Start date: Dec 3, 2012, End date: Dec 31, 2015,

Objectives: The general goal of this project is the industrialization of 28/20nm Fully Depleted (FD) Silicon On Insulator (SOI) Technology platforms, enabling 2 different sources in 2 different European countries. The project also aims at establishing and reinforcing a design ecosystem in Europe using these platforms. Last, the project considers extremely important to explore extension towards FD ...
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 22

 FINISHED 

Integrated Solutions for Agile Manufacturing in High-mix Semiconductor Fabs (INTEGRATE)

Start date: Jan 1, 2013, End date: Dec 31, 2015,

European IC manufacturers are on the way to become suppliers of customized products for OEM companies, which means high flexibility and product diversity. The project aims at conducting research to support the development of new manufacturing procedures, new organizations and new information and control tools to enable IC production lines to efficiently manage a high product and technology mix and ...
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 29

 FINISHED 

New solar collector concept for high temperature operation in CSP applications (HITECO)

Start date: Nov 1, 2010, End date: Oct 31, 2014,

"In order to accelerate the implementation of the CSP technology, the electricity cost has to be reduced by increasing the plants’ efficiency. The HITECO Project aims at doing so by increasing the operating temperature of the heat transfer fluid (HTF) up to 600ºC and therefore raising the overall efficiency of the process. The current state-of-the-art designs are prevented to reach such temperatur ...
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 11

 FINISHED 

Surface Physics for Advanced Manufacturing (SPAM)

Start date: Oct 1, 2008, End date: Sep 30, 2012,

"Today, markets demand smaller, cheaper, energy friendly and more different consumer products. Last decades micro technology has opened possibilities for mobile communication, safety and health science products. To meet these demands, the industry is encountering technological barriers that prevent the industry from evolving from the micro to a nanotechnology era. To resolve these barriers, the i ...
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 12