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5 European Projects Found

Searched on 125080 European Projects

 FINISHED 

Rf Engineered substrates to FostER fEm performaNCE (REFERENCE)

Start date: Dec 1, 2015, End date: May 31, 2019,

The REFERENCE project aims to leverage a European leading edge Radio Frequency (RF) ecosystem based on RF Silicon On Insulator (SOI) disruptive technology, perceived as the most promising to address performance, cost and integration needs for RF Front End Modules (FEMs)s.The project targets to develop over the next 3 years, innovative solutions from material, engineered substrates, process, design ...
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 18

 FINISHED 

Power Semiconductor and Electronics Manufacturing 4.0 (SemI40)

Start date: May 1, 2016, End date: Apr 30, 2019,

Addressing European Policies for 2020 and beyond the “Power Semiconductor and Electronics Manufacturing 4.0” (SemI40) project responds to the urgent need of increasing the competitiveness of the Semiconductor manufacturing industry in Europe through establishing smart, sustainable, and integrated ECS manufacturing. SemI40 will further pave the way for serving highly innovative electronic markets w ...
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 38

 FINISHED 

Enhanced Power Pilot Line - EPPL (EPPL)

Start date: Apr 1, 2013, End date: Mar 31, 2016,

A sustainable and competitive European power semiconductor industry is essential to support the megatrend developments formulated in the Europe 2020 strategy - climate change, energy security, food security, and health and aging population. In practically all these areas, power semiconductors play a vital role. Thus, it is of paramount importance to defend and further extend Europe’s leading posit ...
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 33

 FINISHED 

Processes for MEMS by inkjet enhanced technologies (PROMINENT)

Start date: Mar 1, 2013, End date: Feb 29, 2016,

Prominent aims to incorporate inkjet printing as a part of the MEMS fabrication process. By using maskless, digitally controlled, localized additive processes instead of the subtractive processes used currently, selected steps in the MEMS manufacturing can be done with simplified process sequence. This will result in • lower initial investment cost for a MEMS line• greatly increased flexibility i ...
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 10

 FINISHED 
Future electronic power devices and packages will need to demonstrate more performance and functionality at reduced cost, size, weight, energy consumption and thermal budget. Further, increasing reliability demands have also to be met by industry to be competitive in this growing multi-billion Euro market of heterogeneously integrated systems.To respond to these challenges, new innovative nano- an ...
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 18