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Smart systems consist of heterogeneous subsystems and components providing different functionalities; they are normally implemented as "Multi-Package on a Board". To fully exploit the potential of current nanoelectronics technologies, as well as to enable the integration of existing/new IPs and "More than Moore" devices, smart system miniaturization and "Multi-Chip in a Package" implementation are ...

Electronic devices of the latest generations, being those integrated circuits or discrete components, are often required to operate in harsh environmental conditions, where the temperature may reach over hundred degrees centigrade. Obviously, this has negative impact on several parameters of the electronic devices, ranging from slow-down and transient, recoverable errors to permanent failures and ...