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Packaging of futuRe Integrated ModulAr Electronics (PRIMAE)

Start date: Nov 1, 2010, End date: Oct 31, 2014,

"Affordable transport for the citizen relies on innovative solutions and technologies that will result in lower costs and lead-time of the aircraft and its systems. In this area, the packaging of on-board computers is an important contributor.The Packaging of futuRe Integrated ModulAr Electronics (PRIMAE) objective is to develop a new flexible, robust and open aeronautical packaging for the next g ...
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