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11 European Projects Found

Searched on 125080 European Projects

 FINISHED 

Rf Engineered substrates to FostER fEm performaNCE (REFERENCE)

Start date: Dec 1, 2015, End date: May 31, 2019,

The REFERENCE project aims to leverage a European leading edge Radio Frequency (RF) ecosystem based on RF Silicon On Insulator (SOI) disruptive technology, perceived as the most promising to address performance, cost and integration needs for RF Front End Modules (FEMs)s.The project targets to develop over the next 3 years, innovative solutions from material, engineered substrates, process, design ...
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 18

 FINISHED 

Ultra-Low PoweR technologIes and MEmory architectures for IoT (PRIME)

Start date: Dec 1, 2015, End date: Mar 31, 2019,

The goal of the PRIME project is to establish an open Ultra Low Power (ULP) Technology Platform containing all necessary design and architecture blocks and components which could enable the European industry to increase and strengthen their competitive and leading eco-system and benefit from market opportunities created by the Internet of Things (IoT) revolution. Over 3 years the project will deve ...
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 19

 FINISHED 

THINGS2DO (THINGS2D0)

Start date: Jan 1, 2014, End date: Jan 1, 2018,

Develop the FDSOI ecosystem in Europe, beyond the PLACES2BE Pilot Line, in order to increase the impact of this European technology. At the time of set up of the first KET pilot line the proof of FDSOI was mainly technological. In between then and now, the first realization of a complex silicon chip in FDSOI has shown to the worldwide microelectronics community the capabilities of this technology. ...
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 44

 FINISHED 

Which Architecture Yields Two Other Generations Of Fully depleted Advanced Substrate and Technologies (WAYTOGO FAST)

Start date: May 1, 2015, End date: Apr 30, 2017,

The proposed pilot line project WAYTOGO FAST objective is to leverage Europe leadership in Fully Depleted Silicon on Insulator technology (FDSOI) so as to compete in leading edge technology at node 14nm and beyond preparing as well the following node transistor architecture. Europe is at the root of this breakthrough technology in More Moore law. The project aims at establishing a distributed pilo ...
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 32

 FINISHED 

Technology CAD for III-V Semiconductor-based MOSFETs (III-V-MOS)

Start date: Nov 1, 2013, End date: Apr 30, 2017,

...of atomistic simulations for technology development (QuantumWise); by a research center (IMEC) and an industry lab (IBM) engaged in CMOS fabrication technology development and by the European foundry GLOBALFOUNDRIES Dresden.
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 11

 FINISHED 

Semiconductor Equipment Assessment for Key Enabling Technologies (SEA4KET)

Start date: Nov 1, 2013, End date: Oct 31, 2016,

SEA4KET (Semiconductor Equipment Assessment for Key Enabling Technologies) is an IP proposal taking the consequent step from equipment R&D to equipment assessment experiments. The strategic objective is to effectively combine resources and expertise in a joint assessment of novel equipment for key enabling technologies to foster and accelerate the successful transfer of novel European equipment in ...
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 26

 FINISHED 

Pilot Lines for Advanced CMOS EmbodimentS in 2x nodes, Built in Europe (PLACES2BE)

Start date: Dec 3, 2012, End date: Dec 31, 2015,

...ribute to the cluster policy that is an integral part of the Horizon 2020 strategy.Consortium: PLACES2BE Pilot line gathers 27 experienced partners, including industry leaders such as GLOBALFOUNDRIES, ARM, STEricsson, SOITEC, MENTOR Graphics along the microelectronics value chain, SMEs such as Open Engineering, eSilicon, GSS, Axiom, IBS, RTOs such as the Fraunhoger Gesellschaft, IMEC, and LETI, an ...
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 22

 FINISHED 

Integrated Solutions for Agile Manufacturing in High-mix Semiconductor Fabs (INTEGRATE)

Start date: Jan 1, 2013, End date: Dec 31, 2015,

European IC manufacturers are on the way to become suppliers of customized products for OEM companies, which means high flexibility and product diversity. The project aims at conducting research to support the development of new manufacturing procedures, new organizations and new information and control tools to enable IC production lines to efficiently manage a high product and technology mix and ...
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 29

 FINISHED 

Steep subthreshold slope switches\nfor energy efficient electronics (STEEPER)

Start date: Jun 1, 2010, End date: Nov 30, 2013,

Description European Union Research Initiative Aims to Increase 
Electronic Device Efficiency by 10x and Eliminate Power Consumption of Devices in Standby Mode STEEPER addresses the development of Beyond CMOS energy-efficient steep subthreshold slope transistors based on quantum mechanical band-to ...
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 14

 FINISHED 

Semiconductor Equipment Assessment Leveraging Innovation (SEAL)

Start date: Jun 1, 2010, End date: Sep 30, 2013,

Description Seal is an EC-funded project covering semiconductor equipment assessment to strengthen the European semiconductor equipment industry. SEAL is an integrated project consisting of 17 equipment assessment sub-projects in the area of semiconductor manufacturing equipment. The assessment th ...
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 39

 FINISHED 

MAsk less lithoGraphy for IC manufacturing (MAGIC) (MAGIC)

Start date: Jan 1, 2008, End date: Dec 31, 2010,

Description MAGIC has supported the development of e-beam based maskless lithography technology in Europe: Two parallel lithography tool developments for 32nm CMOS and beyond and on lithography infrastructure.In the CMOS manufacturing environment, the mask-based optical lithography technique is up to now driving solution to deal with all ...
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 19