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Thin Interconnected Package Stacks (TIPS)

Start date: Sep 8, 2008, End date: Mar 7, 2012,

The project TIPS aims at the conflation of embedding technologies for electronic components into extremely thin packages and the interconnection of those packages into stacked electronic systems. The testing of individual packages before stacking is performed will mitigate stacked package yield issues.Embedding of components will be developed starting from a basis of different technical approaches ...
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