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6 European Projects Found

Searched on 125080 European Projects

 FINISHED 
The “Advanced Distributed Pilot Line for More-than-Moore Technologies” project (ADMONT) is focused on a powerful and versatile More-than-Moore (MtM) pilot line for Europe increasing the diversification of CMOS process technologies. The combination of existing expertise, technological capabilities and the manufacturing capacity of industrial and research partners creates a whole new ecosystem withi ...
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 15

 FINISHED 

Power Semiconductor and Electronics Manufacturing 4.0 (SemI40)

Start date: May 1, 2016, End date: Apr 30, 2019,

Addressing European Policies for 2020 and beyond the “Power Semiconductor and Electronics Manufacturing 4.0” (SemI40) project responds to the urgent need of increasing the competitiveness of the Semiconductor manufacturing industry in Europe through establishing smart, sustainable, and integrated ECS manufacturing. SemI40 will further pave the way for serving highly innovative electronic markets w ...
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 38

 FINISHED 
The key objective of PowerBase “Enhanced substrates and GaN pilot lines enabling compact power applications” is to ensure the availability of Electronic Components and Systems (ECS) for key markets and for addressing societal challenges, aiming at keeping Europe at the forefront of the technology development, bridging the gap between research and exploitation, creating economic and employment grow ...
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 40

 FINISHED 

Seven Nanometer Technology (SeNaTe)

Start date: Apr 1, 2015, End date: Mar 31, 2018,

The SeNaTe project is the next in a chain of thematically connected ENIAC JU KET pilot line projects which are associated with 450mm/300mm development for the 12nm and 10nm technology nodes. The main objective is the demonstration of the 7nm IC technology integration in line with the industry needs and the ITRS roadmap on real devices in the Advanced Patterning Center at imec using innovative devi ...
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 41

 FINISHED 

Enable power technologies on 300mm wafer diameter (EPT300)

Start date: Apr 1, 2012, End date: Mar 1, 2015,

EPT 300 aims to be a decisive step forward to strengthen Europe’s leading position in power semiconductor technologies and More-than-Moore manufacturing capabilities relating to energy efficient electronic solutions. Power semiconductor devices fabricated in a European leading pilot line for 300mm wafer production are the scope of the project, for which manufacturing excellence, cost competitivene ...
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 22

 FINISHED 

European 450mm Equipment & Materials Initiative (EEMI 450)

Start date: Apr 1, 2010, End date: Mar 1, 2013,

Large-scale semiconductor fabrication is now standardised on 300mm diameter wafers. However, as demand grows and node dimensions diminish, major chipmakers are considering offsetting the growing costs of miniaturisation by increasing wafer size to 450mm to cut cost per produced die. A prerequisite is the availability of the required quality wafers and equipment able to handle larger wafers. The EN ...
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 27