6 European Projects Found
Searched on 125080 European Projects
FINISHED
Technology Advances and Key Enablers for 5 nm (TAKE5)
Start date: Apr 1, 2016, End date: Mar 31, 2019,
The TAKE5 project is the next in a chain of thematically connected ENIAC JU KET pilot line projects which are associated with 450mm/300mm development for the 10nm technology node and the ECSEL JU project SeNaTe aiming at the 7nm technology node. The main objective of the TAKE5 project is the demonstration of 5nm patterning in line with the industry needs and the ITRS roadmap in the Advanced Patter ...
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13
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FINISHED
Seven Nanometer Technology (SeNaTe)
Start date: Apr 1, 2015, End date: Mar 31, 2018,
The SeNaTe project is the next in a chain of thematically connected ENIAC JU KET pilot line projects which are associated with 450mm/300mm development for the 12nm and 10nm technology nodes. The main objective is the demonstration of the 7nm IC technology integration in line with the industry needs and the ITRS roadmap on real devices in the Advanced Patterning Center at imec using innovative devi ...
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41
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Nanostructured materials and RF-MEMS RFIC/MMIC technologies for highly adaptive and reliable RF systems (NANOTEC)
Start date: Sep 1, 2011, End date: Jul 31, 2015,
RF communication and remote sensing (radar/radiometric) systems are facing the demands ofincreasing complexity/number of frequency bands, increased bandwidths and higher frequencies forhigher data throughput, while at the same time the power consumption, the form factor of the systems,and the overall system costs need to be reduced. Smart micro-/mm-wave systems will have to achieveself-reconfigura ...
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17
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SMArt systems Co-design (SMAC)
Start date: Oct 1, 2011, End date: Mar 31, 2015,
Smart systems consist of heterogeneous subsystems and components providing different functionalities; they are normally implemented as "Multi-Package on a Board". To fully exploit the potential of current nanoelectronics technologies, as well as to enable the integration of existing/new IPs and "More than Moore" devices, smart system miniaturization and "Multi-Chip in a Package" implementation are ...
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18
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Partitioning and Modeling of SiP (PARSIMO)
Start date: Mar 1, 2011, End date: Jun 1, 2014,
Integration of heterogeneous systems in a package (SiP) allows smaller, smarter and more energy efficient products for many applications. Through SiPs, even small or medium-sized enterprises could gain access to the development of technologically advanced, miniaturized products. However, to date, the lack of appropriate design methodologies and flows hinders the efficient development of SiPs. PARS ...
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9
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Customer-Oriented Product Engineering of Micro and Nano Devices (CORONA)
Start date: Jul 1, 2008, End date: Jun 30, 2011,
The competitiveness of EC companies in micro and nano technologies (MNT) very much relies on short time-to-market. That is true in particular for collaborative, distributed design and fabrication scenarios typical for an area where SMEs are strongly involved. Reduced time-to-market can only be achieved by faster product engineering. MNT product design and fabrication process development is an expe ...
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