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 FINISHED 
The thermal properties of nanostructured materials are of fundamental importance to modern technology, but at present reproducible metrological definitions, tools and methods do not exist. This is because the mechanisms of heat transport at the nanoscale are entirely different to those at the macro scale.The project will place nanothermal metrology on a solid basis by an integrated physics-based e ...
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 FINISHED 
Tomorrows micro-electronic devices will have to show more functionality and performance at smaller form factor, lower cost and lower energy consumption in order to be competitive on this multi-billion dollar market. Advanced system integration is thus inevitable, a trend bound to joining dissimilar materials with new packaging technologies. These processes must enable lower thermal resistances and ...
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 FINISHED 
The ENIAC JU project ESiP is addressing the issues of reliability, failure analysis and testing in innovative system-in-package (SiP) solutions. Highly integrated systems with greater miniaturisation and increased functionality open new markets and improve the quality of life through a wide range of applications. In particular, higher systems integration technologies using multi-chip packaging, th ...
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