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Photonic Integrated Circuits Assembly and Packaging Pilot Line (PIXAPP)

Start date: Jan 1, 2017, End date: Dec 31, 2020,

PIXAPP will establish the world’s first open access Photonic Integrated Circuit (PIC) assembly & packaging Pilot Line. It combines a highly-interdisciplinary team of Europe’s leading industrial & research organisations. PIXAPP provides Europe’s SMEs with a unique one-stop-shop, enabling them to exploit the breakthrough advantages of PIC technologies. PIXAPP bridges the ‘valley of death’, providing ...
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Existing optical networks are driven by dynamic user demands but operate statically at their maximum performance and do not offer much adaptability. Thus the links are not energy-efficient. ADDAPT aims at the development and technology take-up of dynamic transceiver subsystems. By implementing performance and power adaptivity from system down to optical device, electrical circuit and transistor le ...
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