Search for European Projects

27 European Projects Found

Searched on 125080 European Projects

 FINISHED 

Ophthalmic OCT on a Chip (OCTCHIP)

Start date: Jan 1, 2016, End date: Dec 31, 2019,

Silicon photonics is expected to leverage-off many of the advances made in CMOS electronics. International R&D efforts in this field have so far been mainly focused on the silicon-on-insulator (SOI) photonic integrated circuit (PIC) technology platform because it is predestined for datacom, high-performance computing and telecom applications. However, SOI based integrated optical waveguides cannot ...
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 7

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Smart Sensor Technologies and Training for Radiation Enhanced Applications andMeasurements (STREAM)

Start date: Jan 1, 2016, End date: Dec 31, 2019,

STREAM is a 4-year multi-site training network that aims at career development of Early Stage Researchers (ESRs) on scientific design, construction manufacturing and of advanced radiation instrumentation. STREAM targets the development of innovative radiation-hard, smart CMOS sensor technologies for scientific and industrial applications. The platform technology developed within the project will b ...
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 11

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Highly Integrated Optoelectronic Sensor (HIOS)

Start date: Aug 1, 2016, End date: Jul 31, 2019,

...bient Light Sensor and derivate such as UV Sensor & Color Sensor. Three main markets which will be addressed are the Wearable, Low Cost Consumer (smart phones, cellular) & Smart Lighting Market.ams already offers prior art TSL2584TSV which is industry’s first ambient light sensor with 3D/TSV and single filter integrated at wafer level. In HIOS project the consortium wants to move one step further ...
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 4

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Pervasive Ubiquitous Lightwave SEnsor (PULSe)

Start date: Jan 1, 2017, End date: Jun 30, 2019,

PULSe's objective is to optimize, industrialize and create the conditions for a market exploitation of the first cost -effective Brillouin distributed sensing solution based on a synergy of innovations on interrogator equipment, strain sensing cable and open-access application support tools.
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 5

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Flexible FE/BE Sensor Pilot Line for the Internet of Everything (IoSense)

Start date: May 1, 2016, End date: Apr 30, 2019,

The EU has set the stage to empower semiconductor manufacturing in Europe being one of the key drivers for innovation and employment and creator for answers to the challenges of the modern society. Aim of IoSense is to boost the European competitiveness of ECS industries by increasing the pilot production capacity and improving Time-to-Market for innovative microelectronics, accomplished by establ ...
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 33

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Nanonets2Sense

Start date: Feb 1, 2016, End date: Jan 31, 2019,

Nanonets2Sense proposes a new technological approach, where random networks of nanowires, called nanonets (NN), allow biosensors for medical applications to be integrated at low cost with a 3D integration scheme. The final objective of the project is to demonstrate 3D above-IC integration of nanonet-based sensing devices on a CMOS platform. By using nanonets as sensing material, our synergetic app ...
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 6

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A generic CMOS-compatible platform for co-integrated plasmonics/photonics/electronics PICs towards volume manufacturing of low energy, small size and high performance photonic devices (PLASMOfab)

Start date: Jan 1, 2016, End date: Dec 31, 2018,

PLASMOfab aims to address the ever increasing needs for low energy, small size, high complexity and high performance mass manufactured PICs by developing a revolutionary yet CMOS-compatible fabrication platform for seamless co-integration of active plasmonics with photonic and supporting electronic. The CMOS-compatible metals Aluminum, Titanium Nitride and Copper, will be thoroughly investigated ...
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 10

 FINISHED 

Large Scale Silicon Photonics Matrix for Low Power and Low Cost Data Centers (L3MATRIX)

Start date: Dec 1, 2015, End date: Nov 30, 2018,

Cloud storage and computing, big data analytics and social media are driving the need for higher bandwidth communications in data centres (DCs). Concurrently, disaggregation and virtualization trends in the DC are forcing the traffic to be between servers and storage elements in the east-west direction. These changes require massive switching capabilities from the discrete switch elements. However ...
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 8

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Enhanced substrates and GaN pilot lines enabling compact power applications (PowerBase)

Start date: May 1, 2015, End date: Apr 30, 2018,

The key objective of PowerBase “Enhanced substrates and GaN pilot lines enabling compact power applications” is to ensure the availability of Electronic Components and Systems (ECS) for key markets and for addressing societal challenges, aiming at keeping Europe at the forefront of the technology development, bridging the gap between research and exploitation, creating economic and employment grow ...
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 40

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Excellence in Speed and Reliability for More Than Moore Technologies (ERAMP)

Start date: Apr 1, 2014, End date: Apr 1, 2017,

Europe’s strengths are based on the deep knowledge and market position in automotive industry, industrial electronics industry and leading know how for More-than-Moore based embedded system. It is of vital interest for the electronics manufacturers in Europe to have fast access to reliable prototypes of electronic devices as well as competitive advanced manufacturing of such devices made in Europe ...
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 26

 FINISHED 

Multi-entity-security using active Transmission Technology for improved Handling of Exportable security credentials Without privacy restrictions (MATTHEW)

Start date: Nov 1, 2013, End date: Oct 31, 2016,

...access control system. An ABC-based cryptographic API will provide pseudonyms for privacy.MATTHEW brings together eight highly qualified European partners, world market leading industries (IFAT, GTO, AMS, IFAG), research oriented SMEs (IMA, TEC, CRX) as well as a high esteemed university institute for ICT security (IAIK).
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 8

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Automotive Tested High Voltage and Embedded Non-Volatile Integrated System on Chip platformemploying 3D Integration (ATHENIS_3D)

Start date: Nov 1, 2013, End date: Oct 31, 2016,

...nd magnetic sensors all meeting reliability requirements up to 200C application temperatures have to be mastered for the first time. This will be achieved by combining TSV and HV-CMOS technology from ams with CMOS and Cu-TSV technology from CEA-Leti, MRAM technology from Crocus and WLP technology from Besi. Platform scalability will be proven by flipchip packaging of 14nm CMOS samples on the inte ...
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 11

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Photonics for High-Performance, Low-Cost & Low-Energy Data Centers, High Performance Computing Systems:Terabit/s Optical Interconnect Technologies for On-Board, Board-to-Board, Rack-to-Rack data links (PhoxTroT)

Start date: Oct 1, 2012, End date: Sep 30, 2016,

PhoxTrot is a large-scale research effort focusing on high-performance, low-energy and cost and small-size optical interconnects across the different hierarchy levels in Data Center and High-Performance Computing Systems: on-board, board-to-board and rack-to-rack. PhoxTrot will tackle optical interconnects in a holistic way, synergizing the different fabrication platforms (CMOS electronics, Si-pho ...
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 22

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Multi-Sensor-Platform for Smart Building Management (MSP)

Start date: Sep 1, 2013, End date: Aug 31, 2016,

The concept of the MSP project is based on a multi-project wafer approach that enables the development of highly innovative components and sensors based on Key Enabling Technologies (KETs). The central objective of the MSP-project is the development of a technology and manufacturing platform for the 3D-integration of sophisticated components and sensors with CMOS technology being the sound foundat ...
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 17

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Enhanced Power Pilot Line - EPPL (EPPL)

Start date: Apr 1, 2013, End date: Mar 31, 2016,

A sustainable and competitive European power semiconductor industry is essential to support the megatrend developments formulated in the Europe 2020 strategy - climate change, energy security, food security, and health and aging population. In practically all these areas, power semiconductors play a vital role. Thus, it is of paramount importance to defend and further extend Europe’s leading posit ...
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 33

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Circuit Stability Under Process Variability and\n Electro-Thermal-Mechanical Coupling (SUPERTHEME)

Start date: Oct 1, 2012, End date: Sep 30, 2015,

Description Among the physical limitations which challenge progress in nanoelectronics for aggressively scaled More Moore, Beyond CMOS and advanced More-than-Moore applications, process variability and the interactions between and with electrical, thermal and mechanical effects are getting more and more critical. Effects from various sources ...
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 9

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Pragmatic solution for parasitic-immune design of electronics ICs for automotive (AUTOMICS)

Start date: Jul 1, 2012, End date: Aug 31, 2015,

Smart Power ICs are extensively used in automotive embedded systems due to their unique capabilities to merge low power and high voltage devices on the same chip, at competitive cost. In such devices, induced electrical coupling noise due to switching of the power stages, when integrating such high voltage (HV) devices with low voltage (LV) functions, is a big issue. During switching, parasitic vo ...
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 10

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Battery Management with Solar Powered Devices (BATTMAN)

Start date: Apr 1, 2012, End date: Mar 1, 2015,

The BattMan project on Battery Management for Solar-Powered Devices is planning to:Design and develop battery-pack systems which manage photovoltaic power feed efficiently and deliver optimized, reliable, low-cost and predictable performance.Batteries and battery management systems are the essential storage elements in any solar-powered application. These systems can be employed in a variety of di ...
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 7

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ENERGY TO SMART GRID (E2SG)

Start date: Apr 1, 2012, End date: Mar 1, 2015,

The target of the overall E2SG project is to devise and design mechanisms and policies to assemble, monitor and control smart grids, i.e. a set of interconnected nodes whose primary goal is to generate, exchange and consume electrical energy in the most efficient and reliable way by exploiting distributed information that is sensed, transmitted and processed over the same set of nodes and links. F ...
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 32

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Energy Storage with lowered cost and improved Safety and Reliability for electrical vehicles (ESTRELIA)

Start date: May 1, 2011, End date: Oct 31, 2014,

High costs together with concerns for driving range, reliability and safety are still the main hindrance for market adaption of full electrical vehicles (FEVs). ESTRELIA aims to provide building blocks with enhanced reliability and safety at lowered costs for smart energy storage for FEVs.This is accomplished by proposing a modular approach with ultracapacitor power packs with higher density with ...
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 9

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Semiconductor Equipment Assessment Leveraging Innovation (SEAL)

Start date: Jun 1, 2010, End date: Sep 30, 2013,

Description Seal is an EC-funded project covering semiconductor equipment assessment to strengthen the European semiconductor equipment industry. SEAL is an integrated project consisting of 17 equipment assessment sub-projects in the area of semiconductor manufacturing equipment. The assessment th ...
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 39

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Process Oriented Electrical Control Units for Electrical Vehicles Developed on a Multi-system Real-time Embedded Platform (POLLUX)

Start date: Mar 1, 2010, End date: Sep 30, 2013,

"The objective of POLLUX is to develop a distributed real time embedded systems platform for next generation electric vehicles, by using a component and programming-based design methodology. Reference designs and embedded systems architectures for high efficiency innovative mechatronics systems will be addressed with regard to requirements on composability, networking, security, robustness, diagno ...
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 37

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Efficient Silicon Multi-Chip System-in-Package Integration - Reliability, Failure Analysis and Test (ESIP)

Start date: May 1, 2010, End date: Apr 1, 2013,

The ENIAC JU project ESiP is addressing the issues of reliability, failure analysis and testing in innovative system-in-package (SiP) solutions. Highly integrated systems with greater miniaturisation and increased functionality open new markets and improve the quality of life through a wide range of applications. In particular, higher systems integration technologies using multi-chip packaging, th ...
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 40

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Central Nervous System Imaging (CSI)

Start date: Mar 1, 2010, End date: Feb 1, 2013,

Diseases affecting the brain and the central nervous system are among those with the greatest impact on our society. The ENIAC JU project CSI aims to advance the state of the art in three-dimensional (3D) medical-imaging platforms to improve the efficiency of the diagnosis and therapy of these serious diseases. The objective of the project is to develop an innovative yet simple and low-cost smart ...
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 15

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COmpact MOdelling Network (COMON) (COMON)

Start date: Dec 1, 2008, End date: Nov 30, 2012,

"The goal of our Network is to address the full development chain of Compact Modeling (CM) of advanced CMOS and III-V technologies, from the technology level to the system level. Our mission is driven by the need to enhance scientific knowledge, transfer scientific and technological knowledge from academia to industry, to strengthen the European integrated circuit (IC) industry with powerful desi ...
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 16

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pHotonics ELectronics functional Integration on CMOS (HELIOS)

Start date: May 1, 2008, End date: Nov 30, 2012,

Photonics on CMOS is a candidate technology for applications where functional integration is needed for improving system performance while reducing size and cost.Functional demonstration of basic building blocks such as a µlaser, a detector, coupling, and link has been realized in previous research projects. As a next step the HELIOS project proposes to integrate photonics components with integrat ...
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 22

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E3Car -> Nanoelectronics for an energy efficient electrical car (E3CAR)

Start date: Feb 1, 2009, End date: Jan 1, 2012,

The objective of the project is the development of nanoelectronics technologies, devices, circuits architectures and modules for electrical cars/vehicles and demonstration of these modules in a final systems.Emissions from road vehicles have to be reduced substantially in the future. The ultimate goal of most car manufacturers is to get to a completely electric vehicle, protecting the environment ...
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 32