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Frequency Agile Microwave Bonding System (FAMOBS)

Start date: Nov 1, 2008, End date: Oct 31, 2012,

The cost of packaging in microelectronics is around 30% of total production costs, but this is rising at an alarming rate due to the increasing consumer demand for smaller and smarter portable electronic devices. In micro-systems, the costs of packaging can be up to 80% of total production costs. Technological advances to reduce packaging costs are therefore of pivotal importance to maintain the c ...
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